3D technology integrates a circuit structure into injection-moulded parts. Through the use of thermoplastic material and its metallisation, 3D circuit carriers can be manufactured which combine electrical and mechanical functions. While flexible and rigid-flexible printed circuit boards are ultimately only spatially fitted in the final application, the MID components are manufactured and assembled in 3D.

This integration of the functionalities opens up completely new approaches in the system development which can now be realised on an economical basis, saving space and resources. In this respect, 3D-MID technology enables intelligent, advantageous and elegant solutions.

LÜBERG ELEKTRONIK is an experienced provider of 3D-MID projects in all process steps and offers a full and versatile service in MID technology, from professional advice on materials and design through to the creation of prototypes and the series production and fitting.

• Conventional injection moulding technology with thermosetting plastics or plastics with additives
• Two-component injection moulding or direct laser structuring as series technology
• Structuring of the component with printed circuit board tracks
• Metallisation with Cu and other metals on request
• Fitting of components, fully or semi-automatic
• State-of-the-art measurement technology for the end-verification

Design freedom

• Integration of electronic and mechanical elements
• New functions
• Miniaturisation: Space, volume and weight savings

Environment-friendliness / Sustainability

• Saving of resources during production
• Reduction in the range of materials
• Improvement in recycling of materials
• Use of less material
• Non-critical disposal